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  • Fully Automated Large-Format Glass Cutting and Splitting Equipment

    Fully Automated Large-Format Glass Cutting and Splitting Equipment

    The Fully Automated Large-Format Glass Cutting and Splitting Equipment is a high-performance laser processing system specifically designed for cutting, splitting, and edge shaping of hard and brittle materials, such as glass, sapphire, ceramics, and quartz.

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  • TGV Glass/Alumina Glass Inductive Etching Machine

    TGV Glass/Alumina Glass Inductive Etching Machine

    The TGV Glass / Alumina Glass Inductive Etching Machine is a state-of-the-art solution for Through Glass Via (TGV) and alumina substrate micro-hole etching applications. It combines inductive laser technology, high-precision motion control, and intelligent automation to achieve uniform, controllable, and repeatable etching on ultra-thin, hard, and brittle materials such as glass, sapphire, and alumina ceramics.

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  • UTG glass Laser Cutting Machine

    UTG glass Laser Cutting Machine

    The UTG Glass Laser Cutting Machine is a cutting-edge laser system developed for processing ultra-thin glass (UTG) and other hard and brittle materials used in advanced display, optics, and semiconductor applications.

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  • Fully Automatic Laser Wafer Marking Machine

    Fully Automatic Laser Wafer Marking Machine

    The Fully Automatic Laser Water Marking Machine is an innovative marking system designed for non-destructive, high-precision water-mark engraving on hard and brittle materials such as glass, sapphire, ceramics, and quartz. It uses advanced laser interference and micro-ablation technology to create clear, smooth, and permanent watermarks inside or on the surface of materials — without causing cracks, micro-damage, or structural deformation.

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  • Fully Automated Laser Boron Ooping Machine

    Fully Automated Laser Boron Ooping Machine

    The Fully Automated Laser Boron Doping Machine is an advanced laser processing system specifically engineered for selective boron doping in high-efficiency solar cell and semiconductor device manufacturing. This equipment utilizes high-precision laser energy to locally introduce boron atoms into silicon wafers, forming p-type semiconductor regions with precise control over depth and concentration.

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  • Fully Automated Laser Phosphorus Ooping Machine

    Fully Automated Laser Phosphorus Ooping Machine

    The Fully Automated Laser Phosphorus Doping Machine is a state-of-the-art laser processing system developed by Inte Laser for high-efficiency solar cell and semiconductor manufacturing. It is designed to perform precise phosphorus doping on silicon wafers or related materials, using an intelligent, fully automated process that ensures uniformity, high doping accuracy, and maximum cell conversion efficiency.

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  • Fully Automated Laser Passivation Layer Oelamination Machine

    Fully Automated Laser Passivation Layer Oelamination Machine

    The Fully Automated Laser Passivation Layer Delamination Machine is a next-generation laser processing system designed for high-precision, high-speed, and automated removal of passivation layers in advanced electronic and semiconductor manufacturing. Developed by Shenzhen Inte Laser Technology Co., Ltd., this equipment represents the company’s continuous innovation in automated high-precision laser applications, integrating state-of-the-art optical systems, motion control, and intelligent automa...

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We also provide the OEM, Meanwhile, we are professional manufacture of laser machines, so we can give you the best quality and the good price.

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