Product Overview

The TGV Glass / Alumina Glass Inductive Etching Machine is a state-of-the-art solution for Through Glass Via (TGV) and alumina substrate micro-hole etching applications.
It combines inductive laser technology, high-precision motion control, and intelligent automation to achieve uniform, controllable, and repeatable etching on ultra-thin, hard, and brittle materials such as glass, sapphire, and alumina ceramics.

Designed specifically for industries that demand extreme accuracy — such as semiconductors, optoelectronics, micro-sensors, and advanced packaging — this system enables high-quality TGV hole formation, micro-channel etching, and surface texturing with minimal thermal damage or material stress.

Compared to traditional mechanical drilling or chemical etching, Inte Laser’s inductive etching technology offers a non-contact, clean, and high-yield process, delivering superior precision and cost efficiency.

Working Principle

The machine uses inductive laser energy coupling to achieve controlled etching on transparent or opaque glass substrates. The laser beam passes through a specially designed optical module, inducing localized heating and micro-ablation within the glass without causing cracking or chipping.

Through the combination of advanced scanning optics, motion control algorithms, and real-time power feedback, the laser system maintains a uniform etch depth and diameter across large wafer or substrate areas.

The non-contact processing approach eliminates tool wear and contamination, making it ideal for mass production of microstructures, vias, and fine patterns in brittle materials.

Advantages

Ultra-fast laser system is used, can achieve different thick-ness cutting and special-shaped cutting of glass;

High resolutionCCD vision system is adopted for intelligent recognition for high cutting accuracy, fast speed, small edge collapse;

Customized industrial control platform for handy operation and process developing for improved processing efficiency and quality.

Technical Parameters

Sample Display

Key Features

High Precision Etching:
Achieves micron-level accuracy in depth and diameter, ideal for TGV glass and alumina-based substrates.

Inductive Laser Technology:
Utilizes an advanced inductive coupling mechanism to deliver smooth, crack-free etching without mechanical stress.

Non-Contact & Damage-Free Processing:
The laser etching process is fully non-mechanical, ensuring zero contamination and no physical contact with the substrate.

Wide Material Compatibility:
Supports a range of hard and brittle materials, including borosilicate glass, alumina ceramic, sapphire, and quartz.

High Throughput Production:
Optimized laser path planning and automation allow for continuous 24/7 operation with stable quality output.

Integrated Vision Alignment System:
The built-in CCD vision and automatic calibration ensure consistent accuracy during large-scale etching.

Energy Efficiency:
Low power consumption design and intelligent energy control contribute to lower operational costs and eco-friendly production.

Customizable System Configuration:
Modular platform design supports various sizes, thicknesses, and application-specific customization.

Data Monitoring & MES Integration:
Real-time process data tracking, production analysis, and compatibility with MES systems for smart manufacturing environments.

Stable & Reliable Performance:
Rigid mechanical design, industrial-grade components, and precision servo systems ensure long-term stability and repeatability.

Applications

The TGV Glass / Alumina Glass Inductive Etching Machine is widely used in industries where high-precision microfabrication is essential. Typical application areas include:

Semiconductor Packaging: For forming Through Glass Via (TGV) holes in interposers and substrate connections.

MEMS Devices: Micro-hole and cavity etching for sensors, pressure detectors, and accelerometers.

Optoelectronics: Processing of optical filters, waveguides, and glass components for displays and communication systems.

Medical Devices: Precision glass and ceramic etching for biosensors, microfluidic chips, and diagnostic tools.

5G & RF Communication Components: Substrate drilling and via-hole processing for high-frequency modules.

Alumina Ceramic Circuit Boards: For micro-via and micro-pattern formation in high-temperature or high-power circuits.

Glass Interposers & Display Panels: Controlled etching for ultra-thin glass used in next-generation displays and sensors.

Its superior accuracy, clean processing, and high consistency make it a perfect fit for R&D labs and high-volume production lines alike.

After-Sales Service and Technical Support

Inte Laser provides comprehensive global service coverage to ensure customers achieve the best performance from their equipment.
Our service commitment includes:

Professional on-site installation and commissioning

Complete operator and engineer training programs

Remote diagnostics, online support, and software updates

Preventive maintenance and spare parts supply

Lifetime technical support and upgrade options

With local service centers and remote access systems, Inte Laser ensures fast response and minimal downtime worldwide.

FAQs (Frequently Asked Questions)

Q1: What is TGV glass and why is laser etching used for it?
A1: TGV (Through Glass Via) glass is used in semiconductor and electronic packaging as an interconnect substrate. Laser etching enables precise via formation without cracking or contamination, which is crucial for miniaturized device integration.

Q2: What materials can the machine process?
A2: It supports borosilicate glass, alumina ceramic, sapphire, quartz, and other brittle materials used in high-end electronics and optical components.

Q3: How does inductive laser etching differ from traditional methods?
A3: Traditional chemical etching or mechanical drilling is slow, wasteful, and prone to defects. Inductive laser etching provides non-contact, localized heating for clean and accurate results without tool wear or chemical residues.

Q4: Can the system be customized for different glass thicknesses?
A4: Yes. Inte Laser offers modular configuration options, enabling the system to handle various thicknesses and material types according to production needs.

Q5: Is the equipment suitable for mass production?
A5: Absolutely. With its high-speed scanning system and automated material handling, the machine supports continuous, high-volume manufacturing while maintaining stable quality.

Q6: How often does the system require maintenance?
A6: The equipment is designed for long service life with minimal maintenance. Routine laser calibration and optical cleaning at regular intervals are usually sufficient.

Q7: Does Inte Laser provide technical training and service support?
A7: Yes. We provide on-site training, remote technical assistance, and full after-sales support to help customers maximize operational performance.