Product Introduction

The single platform model is ideal for small-batch production or research environments requiring compact, precise cutting, while the dual platform model is designed for continuous, high-volume manufacturing, enabling simultaneous loading and cutting operations for maximum productivity.

By integrating smart motion control, ultrafast laser technology, and automated optical alignment, Inte Laser’s cutting systems deliver clean edges, minimal thermal damage, and zero burrs, ensuring consistent product quality for high-end electronics manufacturing.

Working Principle

The machine uses an advanced galvanometer scanning laser system combined with a multi-axis precision platform to perform ultra-fine cutting operations.
The high-energy laser beam is focused through an optical lens onto the circuit substrate, vaporizing or melting the material in a non-contact process.
Real-time CCD vision alignment ensures that every cut is perfectly matched to the circuit pattern, while auto-focusing technology maintains optimal beam quality across different material thicknesses.

This combination of optical precision and intelligent control guarantees micron-level accuracy, making it suitable for even the most demanding electronic circuit applications.

Advantages

Dual platform machine to improve efficiency;

Can realize arbitrary fiducials setting and automatic target finding, automatic expansion compensation for high process precision;

Optional automatic loading and unloading method.

Technical Parameters

Sample Display

Key Features

High Precision and Stability
The system achieves micron-level cutting accuracy through advanced optical design, ensuring minimal distortion and consistent quality across all production runs.

Flexible Platform Configuration
Choose between Single Platform for laboratory, prototyping, or small-batch processing, and Dual Platform for continuous, automated mass production.

High-Speed Galvo Scanning System
Equipped with an ultra-fast galvanometer, the machine enables rapid beam movement for smooth, efficient, and stable processing.

Non-Contact Laser Cutting
Eliminates tool wear and mechanical stress, avoiding deformation or contamination of delicate electronic substrates.

Intelligent Vision Alignment
Integrated CCD visual recognition provides automatic positioning and alignment, improving yield and reducing operator dependency.

Wide Material Compatibility
Capable of cutting various circuit materials, including polyimide (PI), PET, FR4, copper foil, aluminum foil, and flexible laminates.

Compact and Modular Design
Modular platform design allows easy maintenance, system upgrades, and customization based on specific product requirements.

Automation and Connectivity
Supports integration with MES and ERP systems, enabling real-time production tracking, data storage, and smart factory compatibility.

Applications

The Single Platform / Dual Platform Laser Cutting Machine is engineered for electronic circuit manufacturing, where precision, speed, and stability are critical.

Primary Application Fields

Flexible Printed Circuit (FPC) Cutting – Clean and precise separation without mechanical stress or tool wear.

Rigid-Flex PCB Cutting – Accurate contour cutting for multilayer circuit boards.

Coverlay and PI Film Cutting – Non-contact laser processing of thin films for insulation and protection layers.

Metal Foil and Copper Layer Cutting – High-speed laser processing for thin conductive layers.

Camera Module, Touch Panel, and Sensor Components – Fine cutting for miniature parts and sensitive electronic assemblies.

Microelectronics Prototyping and R&D – Precision cutting for experimental circuit development.

Industry Applications

Consumer Electronics (smartphones, tablets, wearables)

Automotive Electronics

5G Communication Devices

Medical Electronics

Industrial Control Boards

Aerospace and Defense Electronics

FAQs (Frequently Asked Questions)

Q1: What is the difference between the Single Platform and Dual Platform models?
A1: The Single Platform model is designed for small-batch or prototype production, while the Dual Platform version supports simultaneous cutting and loading, ideal for continuous high-volume manufacturing.

Q2: What materials can the machine cut?
A2: It is compatible with a wide range of materials used in electronic circuits, including PI, PET, FR4, copper foil, and flexible laminates.

Q3: How accurate is the laser cutting process?
A3: The system achieves micron-level precision, ensuring clean edges and perfect fit for FPC and PCB components.

Q4: Can the system be integrated into an automated production line?
A4: Yes. The equipment supports integration with MES, robotic arms, and automated handling systems for full-scale industrial automation.

Q5: Does the machine require frequent maintenance?
A5: Maintenance is minimal. Regular optical cleaning and calibration ensure stable long-term operation.

Q6: How does the laser cutting process compare to mechanical cutting?
A6: Laser cutting offers higher precision, no tool wear, and zero mechanical stress, making it ideal for delicate electronic materials.

Q7: What type of laser source does the system use?
A7: Inte Laser provides options such as UV laser, green laser, and CO₂ laser, depending on the material and application requirements.