Product Introduction

In modern electronics manufacturing, traditional mechanical depaneling methods (such as routing, punching, or V-cut) often introduce micro-cracks, dust, and stress damage to delicate circuit boards. The Fully Automatic laser splitting machine eliminates these issues by using a non-contact laser process, ensuring high edge quality, dimensional accuracy, and minimal material distortion.

This equipment is an essential tool for high-end PCB and FPC manufacturing, especially for smartphones, tablets, automotive electronics, wearables, and other miniaturized electronic devices.

Advantages

Easy operation with one-click import of CAD drawings;

Capable of achieving automated inline connection for a one-stop service;

The equipment offers high cutting precision, stress-free con-tact, no consumables,no dust, and the ability to cut various shapes of products;

Customized MES interface for product traceability down to each individual item;

Cutting precision up to 0.03mm.

Technical Parameters

Working Principle

The machine operates based on laser ablation technology, where a focused laser beam precisely follows programmed cutting paths to separate circuit boards along pre-defined lines.
The laser energy is absorbed by the material, causing localized melting or vaporization. As a result, the material is cleanly cut without any physical contact or mechanical force.

The system is equipped with:

High-precision galvanometer scanners for fast and accurate beam positioning;

CCD vision alignment system for real-time path correction;

Auto-focus and height control for consistent cutting depth;

Intelligent control software for pattern recognition and multi-layer processing.

This advanced process guarantees smooth edges, minimal heat-affected zones, and reliable repeatability — making it ideal for fine-pitch electronic circuits and flexible substrates.

Sample Display

Key Features

Fully Automated Workflow

From material loading to cutting and unloading, the entire operation is automated, improving productivity and reducing manual errors.

Non-Contact Cutting Process

Eliminates mechanical stress and burrs, preventing cracks and deformation in sensitive circuit boards.

Ultra-High Precision

Laser positioning accuracy within microns ensures consistent cut quality, suitable for complex PCB and FPC designs.

High Efficiency and Flexibility

Capable of handling various materials such as FR4, polyimide, copper-clad laminates, and thin flexible boards.

Cleanroom-Compatible Design

No dust, no debris, and no tool wear — ensuring a clean, contamination-free production environment.

Advanced Vision and Alignment System

Integrated CCD camera for automatic fiducial mark recognition and precise cutting alignment.

Energy-Saving Operation

Optimized optical efficiency reduces energy consumption while maintaining consistent output.

Smart Software Interface

User-friendly interface supports multi-language operation, real-time monitoring, and production data recording.

Stable and Durable Construction

Rigid mechanical frame minimizes vibration, ensuring long-term operational stability and cutting accuracy.

MES Connectivity and Traceability

Supports data integration with factory automation systems for process traceability and smart manufacturing.

Application Scenarios

The Fully Automatic Laser Splitting Machine is widely used in electronic circuit board manufacturing, providing unmatched precision and efficiency for various industries:

Consumer Electronics: PCB and FPC depaneling for smartphones, tablets, and wearable devices.

Automotive Electronics: Laser splitting for automotive control units, sensors, and LED modules.

Communication Devices: Cutting and separating boards for 5G modules and communication baseboards.

Medical Electronics: Precision separation for compact medical sensors and diagnostic devices.

Industrial Control Systems: PCB depaneling for automation controllers and power modules.

Aerospace and Defense: Processing high-density circuit boards requiring maximum reliability.

Its non-contact, dust-free, and flexible operation makes it an indispensable solution for manufacturers seeking to achieve high-speed, high-precision, and high-yield electronic circuit production.

Quality Control and Reliability

Each Inte Laser system undergoes strict factory testing, laser calibration, and performance verification before shipment.
We utilize advanced optical measuring instruments, vibration isolation platforms, and temperature control systems to ensure consistent quality under continuous 24/7 operation.

The machine’s modular design allows easy maintenance and upgrades, ensuring long-term cost efficiency.
All key components — from the laser source to motion control modules — meet international industrial-grade standards for reliability and longevity.

Customer Value and Benefits

Enhanced Cutting Precision: Laser splitting minimizes edge roughness and deformation.

Higher Production Efficiency: Automation reduces cycle time and increases throughput.

Reduced Maintenance Costs: No blade wear or tool replacement required.

Improved Product Consistency: Uniform quality across large-scale production batches.

Eco-Friendly Manufacturing: Zero consumables, no dust, and minimal power waste.

Comprehensive Service: Full technical support, training, and remote maintenance from Inte Laser.

FAQs (Frequently Asked Questions)

Q1: What is the main purpose of a laser splitting machine?
A1: It is used to precisely cut and separate individual PCBs or FPCs from a larger panel, ensuring clean edges and minimal stress on the circuit board.

Q2: How does the laser splitting process compare to mechanical cutting?
A2: Unlike traditional mechanical methods, laser cutting is non-contact, producing no dust, no tool wear, and no stress damage — ideal for high-precision electronic components.

Q3: What materials can be processed by this equipment?
A3: The machine can process a wide range of circuit materials including FR4, polyimide, copper-clad laminate, aluminum substrate, and flexible printed circuits.

Q4: Is the system suitable for mass production?
A4: Yes. The fully automatic laser splitting machine is designed for continuous operation and can integrate seamlessly into automated production lines.

Q5: How accurate is the laser cutting process?
A5: The system achieves micron-level precision, ensuring consistent quality even for ultra-fine electronic circuits.

Q6: What maintenance does the machine require?
A6: Routine inspection and optical calibration are sufficient. Since there are no blades or mechanical tools, maintenance costs are significantly lower than traditional equipment.

Q7: Can the system be customized for specific board types or sizes?
A7: Absolutely. Inte Laser provides tailored solutions based on customer requirements for board size, material type, and production layout.

Q8: Does Inte Laser provide global technical support?
A8: Yes. We offer global after-sales service, including on-site training, remote diagnostics, and lifetime technical support.